New funding - Dry Etch and Deposition Systems
We are pleased to annouce that the LNC has been awarding funding of up almost £3M (including a £2.6M contribution from EPSRC, EP/W006472/1) for a suite of four dry etch and deposition systems, including:
- A deep-silicon reactive ion etcher for through-hole / high-aspect ratio etching into silicon wafers.
- A general purpose ICP-RIE.
- A general purpose parallel plate RIE.
- A high-density PECVD system.
For full details of the EPSRC contribution, click here