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New funding - Dry Etch and Deposition Systems

Category
Funding awarded
Date

We are pleased to annouce that the LNC has been awarding funding of up almost £3M (including a £2.6M contribution from EPSRC, EP/W006472/1) for a suite of four dry etch and deposition systems, including:

  • A deep-silicon reactive ion etcher for through-hole / high-aspect ratio etching into silicon wafers.
  • A general purpose ICP-RIE.
  • A general purpose parallel plate RIE.
  • A high-density PECVD system.

For full details of the EPSRC contribution, click here