New Equipment - HB16 wire bonder from TPT

We are pleased to announce that, today, we have taken delivery of a new HB16 semi-automatic wire bonder that can perform ball, wedge, ribbon and bump bonding using Al, Au and Cu wire, funded by the EPSRC via the TERACOM programme grant. For more information, see here. Once installed and commissioned, training will be offered on the system using the standard training request form (see the Leeds Nanotechnology Cleanroom Users Wiki page).