Dicing, lapping & annealing

• Air spindle for max 60,000 rpm.
• 360° continuous rotation, automatic Θ control with 0.0005° accuracy.
• Manual and automatic alignment modes.
• 0.1 µm Y and Z axis resolution.
• X-axis feed rate 0.01 - 500 mm/sec.
• Optical camera view.
• Tooling includes:
    - 50 - 76.2 mm Ø blade capacity.
• Three-direction water cooling (blade, cutting face, wafer jets)
• Maximum 150 mm Ø substrate size.
• Up to 13 mm thick components (wth 76.2 mm blade)

• Conventional and stitch scribing.
• Automatic breaking function.
• Maximum 100 mm Ø substrate size.
• Motorized Z scribe descent with adjustable angle.
• Adjustable scribing force from 10g - 150g (constant weight).
• Accuracy: ±5 µm.
• Manual 90° substrate rotation.
• Y scribe speed 1 - 100 mm/sec.
• Programmable scribing length.

• PP5D precision lapping and polishing jig, including:
• Automatic parallelism.
• Variable sample loading 0 - 2800 g.
• Maximum 76.2 mm Ø substrate size.
• Dial gauge stock removal indicator.
• Available lapping / polishing plattens include:
    - Cast iron: grooved and non-grooved
    - Glass: grooved and non-grooved
• CMP slurry delivering system
• Dedicated slurry cylinders for process solution auto feed, including:
    - Alumina ( 9 µm, 3 µm, 0.30 µm).
    - SF1 colloidal silica.
    - Chemlox.
• Lapping and polishing of
    - Glass, sapphire, fused silica, etc.
    - Metal films.
    - Semiconductors and dielectrics, including III-V semiconductors.

• Annealing environments include:
    - Vacuum
    - N₂
    - N₂-H₂(5%)
• Pyrometer and thermocouple thermometry.
    - Maximum temperature 1000 °C
    - Maximum temperature ramp rate 200 °C/s.
    - Maximum 100 mm Ø substrate size

• Temperature range: ambient + 9° - 220°C.
• Digital temperature and pressure display.
• Programmable temperature ramps.
• Manual vacuum-purge capability.
• Principle uses include:
    - BCB curing in low-O₂ atmosphere.
    - PDMS outgassing.
• For non-flammable materials.