New capability in Dry Etch

The Leeds Nanotechnology Cleanroom is proud to announce the release of its latest technological advancements. Following intensive work by the Cleanroom team at Leeds and excellent customer support from Oxford Instruments, the Estrelas Deep Silicon Etcher and the Plasma Pro 80+ RIE are now available to both internal and external customers.

The Estrelas leverages the latest developments in Silicon etching utilising either Bosch or Cryogenic processes to deliver outstanding, repeatable results across a wide range of linewidths—from sub-50nm to over 100µm. It offers precise control over etch depths, ranging from just tens of nanometres to full wafer-via etching. The tool can be configured to process part pieces up to 200mm wafers and is equipped with the advanced Verity SD1024GH optical endpoint system for superior process control.

The Plasma Pro 80+, configured with eight gas lines and featuring both Laser (Horiba G50 670nm Interferometer) and Optical (OceanOptics USB400) endpoint detection, supports a wide range of processes. These include traditional oxide and nitride etching as well as more specialized materials. Like the Estrelas, it accommodates various substrate sizes, up to 200mm wafers.
Stay tuned for further updates as we prepare to release additional Oxford Instruments systems, including the PlasmaPro100 Cobra and PlasmaPro100 ICP-CVD.