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New Equipment - HB16 wire bonder from TPT

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We are pleased to announce that, today, we have taken delivery of a new HB16 semi-automatic wire bonder that can perform ball, wedge, ribbon and bump bonding using Al, Au and Cu wire, funded by the EPSRC via the TERACOM programme grant. For more information, see here. Once installed and commissioned, training will be offered...

New Equipment - Die Bonder

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We are pleased to announce the introduction of a Finetech Fineplace Lambda 2 Die bonder to the cleanroom. The bonder is capable of thermocompression, adhesive, and epoxy bonding devices onto host substrates with sub-micron-precision. For a full list of capabilities, please visit our equipment database.

New equipment - Parylene Coater

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Capable of depositing either parylene-N or parylene-C, whether you want a high-quality dielectric layer, a bio-compatible anti-fouling coating for your microfluidics, or permittivity matching coating for your optical devices, our new PDS 2010 Labcoter 2 parylene coater from Speciality Coating Services can meet your requirements.

New Equipment - Reflectometer

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The catchily named FR-pRo D VIS/NIR Reflectometer from Thetametrics is the latest addition to our metrology suite, allowing the non-contact characterisation of transparent films across the 15 nm – 200 um thickness range.